CONDUCTIVE PARTICLE AND ANISOTROPIC CONDUCTIVE ADHESIVE

PROBLEM TO BE SOLVED: To provide an anisotropic conductive adhesive which is excellent in corrosion resistance and in connection reliability, and to provide a conductive particle which contributes to improving the connection reliability of the anisotropic conductive adhesive.SOLUTION: A conductive p...

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Bibliographische Detailangaben
Hauptverfasser:	MATSUZAWA MITSUHARU, TAMURA MASASHI, EJIRI YOSHINORI, TAKAI KENJI, AKAI KUNIHIKO, YAMAMURA TAIZO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASTING CHEMISTRY CONDUCTORS CURRENT COLLECTORS DYES ELECTRICITY INSULATORS LINE CONNECTORS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES POWDER METALLURGY SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an anisotropic conductive adhesive which is excellent in corrosion resistance and in connection reliability, and to provide a conductive particle which contributes to improving the connection reliability of the anisotropic conductive adhesive.SOLUTION: A conductive particle includes: a core particle 12; a metal plating layer 15 covering the core particle 12; and a rust preventive film 18 covering the metal plating layer 15. The rust preventive film 18 includes at least one organic compound selected from a group consisting of: a triazole-based compound represented by formula (1); a thiazole-based compound represented by predetermined formula; a phosphate-based compound represented by predetermined formula; and an aliphatic acid represented by predetermined formula. 80 mol% or more of the total organic compounds included in the rust preventive film 18 is coordinately bonded to the metal plating layer 15. In formula (1), Rrepresents a hydrogen atom, a carboxyl group, or the like, and Rrepresents a hydrogen atom, an alkali metal atom, or the like.