TRUE STRESS MEASURING METHOD AND APPARATUS

TRUE STRESS MEASURING METHOD AND APPARATUS

PROBLEM TO BE SOLVED: To measure cross sectional area of a narrowed portion in real time during a tensile test, thereby measuring true stress actually applied to a test piece in real time.SOLUTION: During a tensile test, an imaging apparatus 26 images a narrowed part S in a test piece T. An illumina...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TAJO SHUNSUKE, TEZUKA YASUHARU, SAKAI KATSUYUKI, NAKAMURA TOSHIO
Format: Patent
Sprache:eng
Schlagworte:
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
TESTING
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To measure cross sectional area of a narrowed portion in real time during a tensile test, thereby measuring true stress actually applied to a test piece in real time.SOLUTION: During a tensile test, an imaging apparatus 26 images a narrowed part S in a test piece T. An illumination lamp 28 irradiates the test piece Ta with light from a side opposite the imaging apparatus 26 to clearly project contour of the test piece Ta. The captured image is image-processed in an image processing device 30, to determine cross sectional area Aof the narrowed part S. True stress applied to the test piece Tis calculated from the determined cross sectional area A.