MANUFACTURING METHOD OF WAFER

PROBLEM TO BE SOLVED: To provide a manufacturing method of a wafer capable of securing a sufficient processing distance even when a cutting process is advanced, concerning a method for cutting a workpiece to obtain a wafer by bringing the workpiece into pressure contact with a traveling wire.SOLUTIO...

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Bibliographische Detailangaben
1. Verfasser:	KAJIMOTO TETSUJI
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a manufacturing method of a wafer capable of securing a sufficient processing distance even when a cutting process is advanced, concerning a method for cutting a workpiece to obtain a wafer by bringing the workpiece into pressure contact with a traveling wire.SOLUTION: In a manufacturing method for cutting a workpiece to obtain a wafer by bringing a workpiece into pressure contact with a traveling wire, the workpiece is subjected to oscillatory movement by an oscillation mechanism having the center of oscillation on the opposite side to the arrangement side of the workpiece with respect to a traveling wire.