MULTI-CHIP OPTICAL INTEGRATED MODULE

PROBLEM TO BE SOLVED: To provide a multi-chip optical integrated module which is less degraded in optical connection performance and reliability against changes of an environmental temperature and has high functionality and high performance.SOLUTION: In a configuration where thermal expansion displa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FUKUMITSU TAKAO, OGAWA IKUO, TANOBE HIROMASA, DOI YOSHIYUKI, MIZUNO TAKAYUKI, OOYAMA TAKAHARU, TSUZUKI TAKESHI, MINO SHINJI
Format:	Patent
Sprache:	eng
Schlagworte:	OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS
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