MULTI-CHIP OPTICAL INTEGRATED MODULE

PROBLEM TO BE SOLVED: To provide a multi-chip optical integrated module which is less degraded in optical connection performance and reliability against changes of an environmental temperature and has high functionality and high performance.SOLUTION: In a configuration where thermal expansion displacement of a common fixing member is compensated with thermal expansion displacement of an adjustment member by connection of the common fixing member via the adjustment member, a PLC 110 is fixed to an aluminum sub-mount 134 as the adjustment member. The PLC 110 is stuck onto the aluminum sub-mount 134 with an elastic adhesive 132 and a heat conduction paste 133, and the aluminum sub-mount 134 is mounted on a CuW common mount 131 and has one end part fixed. Thermal expansion displacement of the fixing member common to a pair of optical elements is compensated with the adjustment member, so that a position of an optical connection end can be held independently of fixing for heat release and securing a mechanical strength.