RESIN COMPOSITION, PREPREG, LAMINATE, RESIN SHEET, PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide: a resin composition which exhibits a low linear expansion coefficient and high heat resistance and can provide a cured product excellent in adhesion to a metal layer; and a prepreg, a laminate, a resin sheet, a printed wiring board, and a semiconductor device using...

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Bibliographische Detailangaben
1. Verfasser:	TOBISAWA AKIHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide: a resin composition which exhibits a low linear expansion coefficient and high heat resistance and can provide a cured product excellent in adhesion to a metal layer; and a prepreg, a laminate, a resin sheet, a printed wiring board, and a semiconductor device using the same.SOLUTION: A resin composition comprises: a maleimide compound having at least two maleimide skeletons; an aromatic diamine compound having an aromatic ring structure as well as at least two amino groups; a catalyst comprising a compound represented by the specified general formula (1); and silica.