MULTICHIP MODULE
PROBLEM TO BE SOLVED: To narrow an interval between LSI chips in a multichip module.SOLUTION: A multichip module includes: a package substrate; a plurality of chips which are arranged on the package substrate and are electrically connected to the package substrate; and a wiring board arranged on an...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | PROBLEM TO BE SOLVED: To narrow an interval between LSI chips in a multichip module.SOLUTION: A multichip module includes: a package substrate; a plurality of chips which are arranged on the package substrate and are electrically connected to the package substrate; and a wiring board arranged on an opposite side of a package substrate side in the chip. The wiring board has a wiring pattern which electrically connects the two chips through via holes and solder bumps, which are formed in the two chips among the plurality of chips. |
|---|