PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a highly reliable printed wiring board capable of preventing occurrence of cracks due to stress applied to a periphery of a land electrode.SOLUTION: A side wall of a lowermost resin insulation layer between a first face of the lowermost resin insulation layer and an...

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1. Verfasser: MORI YOJI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a highly reliable printed wiring board capable of preventing occurrence of cracks due to stress applied to a periphery of a land electrode.SOLUTION: A side wall of a lowermost resin insulation layer between a first face of the lowermost resin insulation layer and an exposed surface is not straight and is partially dented. The side wall of the lowermost resin insulation layer forms a recess CP between the first face of the lowermost resin insulation layer and the exposed surface. A space SP is formed by a third space SP3 between the exposed surface DM and the recess CP, a second space SP2 including the recess CP and a first space SP1 between the recess CP and the first face F. An electrode 158 DE formed on the first face side of the lowermost resin insulation layer 50 is buried in the lowermost resin insulation layer 50 and the electrode is dented from the first face F of the lowermost resin insulation layer.