SUBSTRATE CONVEYANCE TRAY FOR FILM FORMING DEVICE AND EXTERNAL OPENING/CLOSING DRIVE DEVICE
PROBLEM TO BE SOLVED: To provide a substrate conveyance tray for a film forming device which holds a substrate in a plurality of directions while distributing a stress which acts on the substrate when holding the substrate.SOLUTION: The substrate conveyance tray comprises: a tray body 21 in which, w...
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| creator | IIO ITSUSHI |
| description | PROBLEM TO BE SOLVED: To provide a substrate conveyance tray for a film forming device which holds a substrate in a plurality of directions while distributing a stress which acts on the substrate when holding the substrate.SOLUTION: The substrate conveyance tray comprises: a tray body 21 in which, when two directions orthogonal with a thickness direction of a substrate and crossing each other are defined as a first direction and a second direction, a pair of sides opposing in the first direction are parallel and a pair of sides opposing in the second direction are parallel; and a substrate support member 51 which is movable toward the center of the tray body while kept parallel with the sides and can be abutted to an end face of the substrate, and the substrate support member is mounted to each of sides 31-33. |
| format | Patent |
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and a substrate support member 51 which is movable toward the center of the tray body while kept parallel with the sides and can be abutted to an end face of the substrate, and the substrate support member is mounted to each of sides 31-33.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140501&DB=EPODOC&CC=JP&NR=2014078601A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140501&DB=EPODOC&CC=JP&NR=2014078601A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>IIO ITSUSHI</creatorcontrib><title>SUBSTRATE CONVEYANCE TRAY FOR FILM FORMING DEVICE AND EXTERNAL OPENING/CLOSING DRIVE DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a substrate conveyance tray for a film forming device which holds a substrate in a plurality of directions while distributing a stress which acts on the substrate when holding the substrate.SOLUTION: The substrate conveyance tray comprises: a tray body 21 in which, when two directions orthogonal with a thickness direction of a substrate and crossing each other are defined as a first direction and a second direction, a pair of sides opposing in the first direction are parallel and a pair of sides opposing in the second direction are parallel; 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and a substrate support member 51 which is movable toward the center of the tray body while kept parallel with the sides and can be abutted to an end face of the substrate, and the substrate support member is mounted to each of sides 31-33.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | SUBSTRATE CONVEYANCE TRAY FOR FILM FORMING DEVICE AND EXTERNAL OPENING/CLOSING DRIVE DEVICE |
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