PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a printed wiring board capable of easily and surely improving a connection strength between a blind via hole and a land part of a substrate rear surface side.SOLUTION: A printed wiring board comprises: a substrate having an insulation property; a first conductive pattern stacked on a surface of the substrate; a second conductive pattern stacked on a rear surface of the substrate; and an interstitial via hole passing through the first conductive pattern and the substrate. At least connection surface with the interstitial via hole of the surface of the second conductive pattern, has a fine rugged shape. It is preferred that an arithmetic average roughness (Ra) of the connection surface is equal to or more than 0.1 μm and equal to or less than 0.6 μm, and a maximum height (Rz) is equal to or more than 1 μm and equal to or less than 10 μm.