PHOTOCURABLE RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a photocurable resin composition which can suppress hygroscopicity and can improve hot-cold cycle resistance in its cured product without impairing migration resistance when used for a printed wiring board.SOLUTION: A photocurable resin composition contains a carboxy...

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Bibliographische Detailangaben
Hauptverfasser:	MINEGISHI MASASHI, ARIMA MASAO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a photocurable resin composition which can suppress hygroscopicity and can improve hot-cold cycle resistance in its cured product without impairing migration resistance when used for a printed wiring board.SOLUTION: A photocurable resin composition contains a carboxylic acid-containing resin, a photopolymerization initiator, a blocked isocyanate compound, a maleimide compound, and an elastomer.