VACUUM FILM DEPOSITION DEVICE AND VACUUM FILM DEPOSITION METHOD

PROBLEM TO BE SOLVED: To provide a vacuum film deposition device and a vacuum film deposition method that can prevent particles from sticking on a base material film before film deposition.SOLUTION: A vacuum film deposition device includes: a vacuum chamber 10; a supply part 2 which supplies a base...

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Bibliographische Detailangaben
Hauptverfasser:	HATTA YOSHIHISA, FURUKAWA MANABU
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a vacuum film deposition device and a vacuum film deposition method that can prevent particles from sticking on a base material film before film deposition.SOLUTION: A vacuum film deposition device includes: a vacuum chamber 10; a supply part 2 which supplies a base material film A with a protective film formed by sticking a protective film C on a base material film B in advance; a peeling part 3 which is provided in the vacuum chamber 10 and peels the protective film C from the base material film A with the protective film supplied from the supply part 2 so as to obtain the base material film B; and a film deposition part 4 which is provided in the vacuum chamber 10, and vapor-deposits a predetermined component on a top surface of the base material film B obtained from the peeling part 3 so as to form a thin film on the top surface.