SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND ADHESIVE SHEET
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which enables a semiconductor device to be simply manufactured when the semiconductor device is manufactured by mounting a work on wiring formed on a base and subsequently separating the work with the wiring from the base.S...
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| creator | ISHII ATSUSHI UENDA DAISUKE |
| description | PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which enables a semiconductor device to be simply manufactured when the semiconductor device is manufactured by mounting a work on wiring formed on a base and subsequently separating the work with the wiring from the base.SOLUTION: A manufacturing method of a semiconductor device comprises: a process of preparing an adhesive sheet which has a first adhesive layer and a second layer having an adhesive force after being attached to a base, which is lower than that of the first adhesive layer, in which a peripheral part is formed by the first adhesive layer and a central part inside the peripheral part is formed by the second layer; a process of laminating the adhesive sheet on the base; a process of forming wiring on the adhesive sheet; a process of mounting a work on the wiring; and a process of separating from the base, the work with the wiring by slitting the adhesive sheet from the work side to reach the central part of the adhesive sheet after being mounted. |
| format | Patent |
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a process of laminating the adhesive sheet on the base; a process of forming wiring on the adhesive sheet; a process of mounting a work on the wiring; and a process of separating from the base, the work with the wiring by slitting the adhesive sheet from the work side to reach the central part of the adhesive sheet after being mounted.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140421&DB=EPODOC&CC=JP&NR=2014072440A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140421&DB=EPODOC&CC=JP&NR=2014072440A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ISHII ATSUSHI</creatorcontrib><creatorcontrib>UENDA DAISUKE</creatorcontrib><title>SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND ADHESIVE SHEET</title><description>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which enables a semiconductor device to be simply manufactured when the semiconductor device is manufactured by mounting a work on wiring formed on a base and subsequently separating the work with the wiring from the base.SOLUTION: A manufacturing method of a semiconductor device comprises: a process of preparing an adhesive sheet which has a first adhesive layer and a second layer having an adhesive force after being attached to a base, which is lower than that of the first adhesive layer, in which a peripheral part is formed by the first adhesive layer and a central part inside the peripheral part is formed by the second layer; 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a process of laminating the adhesive sheet on the base; a process of forming wiring on the adhesive sheet; a process of mounting a work on the wiring; and a process of separating from the base, the work with the wiring by slitting the adhesive sheet from the work side to reach the central part of the adhesive sheet after being mounted.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
| title | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND ADHESIVE SHEET |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T12%3A43%3A13IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ISHII%20ATSUSHI&rft.date=2014-04-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2014072440A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |