SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND ADHESIVE SHEET

PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which enables a semiconductor device to be simply manufactured when the semiconductor device is manufactured by mounting a work on wiring formed on a base and subsequently separating the work with the wiring from the base.S...

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Bibliographische Detailangaben
Hauptverfasser:	ISHII ATSUSHI, UENDA DAISUKE
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which enables a semiconductor device to be simply manufactured when the semiconductor device is manufactured by mounting a work on wiring formed on a base and subsequently separating the work with the wiring from the base.SOLUTION: A manufacturing method of a semiconductor device comprises: a process of preparing an adhesive sheet which has a first adhesive layer and a second layer having an adhesive force after being attached to a base, which is lower than that of the first adhesive layer, in which a peripheral part is formed by the first adhesive layer and a central part inside the peripheral part is formed by the second layer; a process of laminating the adhesive sheet on the base; a process of forming wiring on the adhesive sheet; a process of mounting a work on the wiring; and a process of separating from the base, the work with the wiring by slitting the adhesive sheet from the work side to reach the central part of the adhesive sheet after being mounted.