PLANAR HOLDING MECHANISM, SUBSTRATE BONDING DEVICE AND SUBSTRATE BONDING METHOD

PROBLEM TO BE SOLVED: To correct warp of a planar body.SOLUTION: A planar body holding mechanism 200 for holding a display substrate 101, arranged in a vacuum container 10 capable of setting a vacuum chamber 10a to a first pressure lower than the atmospheric pressure, comprises: a mounting part 220;...

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Bibliographische Detailangaben
1. Verfasser:	YAMAZAKI FUJIO
Format:	Patent
Sprache:	eng
Schlagworte:	ADVERTISING BASIC ELECTRIC ELEMENTS CRYPTOGRAPHY DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DISPLAY DISPLAYING EDUCATION ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING LABELS OR NAME-PLATES NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SEALS SEMICONDUCTOR DEVICES SIGNS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To correct warp of a planar body.SOLUTION: A planar body holding mechanism 200 for holding a display substrate 101, arranged in a vacuum container 10 capable of setting a vacuum chamber 10a to a first pressure lower than the atmospheric pressure, comprises: a mounting part 220; piping 230; a second vacuum pump 240; and a pressure balancer 260. The mounting part 220 has a sucker 225 on the upper surface, where the display substrate 101 is mounted. The piping 230 has one end interconnected with the cylindrical hole of the sucker 255. The second vacuum pump 240 is coupled with the other end of the piping 230 and sucks the gas in the piping 230. The pressure balancer 260 has an interconnection 261 in which an interconnection hole 265 interconnecting the vacuum chamber 10a and the piping 230 is formed, and a lid 262 for opening the interconnection hole 265 when the internal pressure of the vacuum container 10 is lower than the internal pressure of the piping 230, and closing the interconnection hole 265 when the internal pressure of the vacuum container 10 is higher than the internal pressure of the piping 230.