SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To improve product yield of a back side illumination CMOS image sensor.SOLUTION: In a semiconductor device, by forming in a pixel part, dummy wiring DM which is composed of a metal film in the same layer with signal wiring M3, an occupancy of the signal wiring M3 and the dummy...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	ICHINOSE KAZUHITO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
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