PATTERN ADHESIVE BODY AND PRODUCTION METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a production method of a pattern adhesive body capable of improving production efficiency, and to provide the pattern adhesive body.SOLUTION: A production method of a pattern adhesive body 30 includes: a pattern formation step of cutting an adhesive layer 23 of an ad...

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Bibliographische Detailangaben
Hauptverfasser:	NISHIDA YOSHIMASA, MORISHITA HIROMITSU, TSUZUKI KEIKAZU, SUGIMOTO SHUJI, SUZUKI TAKAFUMI, NATSUME MASAYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY CUTTING CUTTING-OUT DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING DYES HAND CUTTING TOOLS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORATING PERFORMING OPERATIONS POLISHES PUNCHING SEVERING SEVERING BY MEANS OTHER THAN CUTTING STAMPING-OUT TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a production method of a pattern adhesive body capable of improving production efficiency, and to provide the pattern adhesive body.SOLUTION: A production method of a pattern adhesive body 30 includes: a pattern formation step of cutting an adhesive layer 23 of an adhesive film 20 having a release substrate film 22 and the adhesive layer 23 laminated on one side of the release substrate film 22, so as to form a first slit 41 of a pattern shape; and an outer frame formation step of cutting the release substrate film 22 and the adhesive layer 23 so as to form a second slit 42 of an outer frame shape surrounding the pattern shape. The second slit 42 has a discontinuous portion 43 in the cutting direction.