SOLDER ALLOY FOR JOINING ALUMINUM

PROBLEM TO BE SOLVED: To provide a solder alloy for joining Sn-Zn aluminum, which improves solderability by suppressing oxidation of the solder alloy.SOLUTION: In a solder alloy for joining aluminum, 10.0-30.0 wt.% of Zn and 0.1-3.0 wt.% of Al are added to Sn. Ag, Sb, Ni, Co, Fe, Cr and the like can...

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Bibliographische Detailangaben
Hauptverfasser:	IGARASHI GAKUO, KANEKO KAZUHIKO, KADOTA TAKASHI, MAEDA YUKIO, SAWAMURA SADA
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a solder alloy for joining Sn-Zn aluminum, which improves solderability by suppressing oxidation of the solder alloy.SOLUTION: In a solder alloy for joining aluminum, 10.0-30.0 wt.% of Zn and 0.1-3.0 wt.% of Al are added to Sn. Ag, Sb, Ni, Co, Fe, Cr and the like can also be added as strength improving elements, Bi, In and the like can also be added as melting point lowering elements, or P, Ga, Ge and the like can also be added as antioxidation elements.