PLATE-LIKE BODY HOLDING MECHANISM, SUBSTRATE STICKING DEVICE, AND SUBSTRATE STICKING METHOD

PROBLEM TO BE SOLVED: To correct warpage of a plate-like body.SOLUTION: There is provided a plate-like body holding mechanism 5 which holds a cover substrate 121 arranged in a vacuum container 10 set to first pressure, and includes a flat plate part 511, piping 53, a second vacuum pump 54, a pressur...

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Hauptverfasser: KINUGAWA KOHEI, YAMAZAKI FUJIO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To correct warpage of a plate-like body.SOLUTION: There is provided a plate-like body holding mechanism 5 which holds a cover substrate 121 arranged in a vacuum container 10 set to first pressure, and includes a flat plate part 511, piping 53, a second vacuum pump 54, a pressure balancer 56, and a suction part 52. The flat plate part 511 is formed with a suction opening 514 and the piping 53 has one end part linked to the suction opening 514. The second vacuum pump 54 is coupled to the other end of the piping 53, and performs a sucking operation to suck the gas in the piping 53 so as to set the pressure in the piping 53 to second pressure higher than first pressure. The pressure balancer 56 has a communication hole 561 formed with a communication hole 563 for linking the inside of the vacuum container 10 to the inside of the piping 53, and a lid part 562 which opens the communication hole 563 when the pressure in the vacuum container 10 is lower than the pressure in the piping 53 and closes the communication hole 563 when the pressure in the vacuum container 10 is higher than the pressure in the piping 53. The suction part 52 holds the cover substrate 121 drawn to the flat plate part 511.