VAPOR DEPOSITION APPARATUS, AND VAPOR DEPOSITION METHOD
PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus capable of highly-precise vapor deposition in which a mask frame of low-cost and light-weight is constituted while a substrate and a vapor deposition mask are moved separately relatively to each other, vapor deposition mask exchanging and...
Gespeichert in:
| Hauptverfasser: | , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | TAKAHASHI MASARU MATSUMOTO EIICHI TAMURA HIROYUKI FUJITSUKA MASANAO SHIOIRI NOBURO KARIYA TOSHIMITSU |
| description | PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus capable of highly-precise vapor deposition in which a mask frame of low-cost and light-weight is constituted while a substrate and a vapor deposition mask are moved separately relatively to each other, vapor deposition mask exchanging and so on are performed very easily and vapor deposition pattern deviation due to temperature rising is not caused because of suppression of temperature rising.SOLUTION: In a vapor deposition apparatus, a substrate 4 is moved relatively against a mask holder 6 having a dispersion-limiting section to limit a dispersion direction of evaporated particles and against an evaporation source 1, with keeping to be separate from a vapor deposition mask 2 mounted at the mask holder 6, to realize vapor deposition over a wider area than the vapor deposition mask 2. The mask holder 6 is constituted as separate bodies of a mask frame 6A equipped with the vapor deposition mask 2 and a mask frame holder 6B equipped with the dispersion-limiting section and a temperature control unit 9. A mask frame 6A mounted in contact at the mask frame holder 6B is constituted as detachable. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2014065936A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2014065936A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2014065936A3</originalsourceid><addsrcrecordid>eNrjZDAPcwzwD1JwcQ3wD_YM8fT3U3AMCHAMcgwJDdZRcPRzUcCQ93UN8fB34WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgaGJgZmppbGZo7GRCkCAKGEKNc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>VAPOR DEPOSITION APPARATUS, AND VAPOR DEPOSITION METHOD</title><source>esp@cenet</source><creator>TAKAHASHI MASARU ; MATSUMOTO EIICHI ; TAMURA HIROYUKI ; FUJITSUKA MASANAO ; SHIOIRI NOBURO ; KARIYA TOSHIMITSU</creator><creatorcontrib>TAKAHASHI MASARU ; MATSUMOTO EIICHI ; TAMURA HIROYUKI ; FUJITSUKA MASANAO ; SHIOIRI NOBURO ; KARIYA TOSHIMITSU</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus capable of highly-precise vapor deposition in which a mask frame of low-cost and light-weight is constituted while a substrate and a vapor deposition mask are moved separately relatively to each other, vapor deposition mask exchanging and so on are performed very easily and vapor deposition pattern deviation due to temperature rising is not caused because of suppression of temperature rising.SOLUTION: In a vapor deposition apparatus, a substrate 4 is moved relatively against a mask holder 6 having a dispersion-limiting section to limit a dispersion direction of evaporated particles and against an evaporation source 1, with keeping to be separate from a vapor deposition mask 2 mounted at the mask holder 6, to realize vapor deposition over a wider area than the vapor deposition mask 2. The mask holder 6 is constituted as separate bodies of a mask frame 6A equipped with the vapor deposition mask 2 and a mask frame holder 6B equipped with the dispersion-limiting section and a temperature control unit 9. A mask frame 6A mounted in contact at the mask frame holder 6B is constituted as detachable.</description><language>eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140417&DB=EPODOC&CC=JP&NR=2014065936A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140417&DB=EPODOC&CC=JP&NR=2014065936A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKAHASHI MASARU</creatorcontrib><creatorcontrib>MATSUMOTO EIICHI</creatorcontrib><creatorcontrib>TAMURA HIROYUKI</creatorcontrib><creatorcontrib>FUJITSUKA MASANAO</creatorcontrib><creatorcontrib>SHIOIRI NOBURO</creatorcontrib><creatorcontrib>KARIYA TOSHIMITSU</creatorcontrib><title>VAPOR DEPOSITION APPARATUS, AND VAPOR DEPOSITION METHOD</title><description>PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus capable of highly-precise vapor deposition in which a mask frame of low-cost and light-weight is constituted while a substrate and a vapor deposition mask are moved separately relatively to each other, vapor deposition mask exchanging and so on are performed very easily and vapor deposition pattern deviation due to temperature rising is not caused because of suppression of temperature rising.SOLUTION: In a vapor deposition apparatus, a substrate 4 is moved relatively against a mask holder 6 having a dispersion-limiting section to limit a dispersion direction of evaporated particles and against an evaporation source 1, with keeping to be separate from a vapor deposition mask 2 mounted at the mask holder 6, to realize vapor deposition over a wider area than the vapor deposition mask 2. The mask holder 6 is constituted as separate bodies of a mask frame 6A equipped with the vapor deposition mask 2 and a mask frame holder 6B equipped with the dispersion-limiting section and a temperature control unit 9. A mask frame 6A mounted in contact at the mask frame holder 6B is constituted as detachable.</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAPcwzwD1JwcQ3wD_YM8fT3U3AMCHAMcgwJDdZRcPRzUcCQ93UN8fB34WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgaGJgZmppbGZo7GRCkCAKGEKNc</recordid><startdate>20140417</startdate><enddate>20140417</enddate><creator>TAKAHASHI MASARU</creator><creator>MATSUMOTO EIICHI</creator><creator>TAMURA HIROYUKI</creator><creator>FUJITSUKA MASANAO</creator><creator>SHIOIRI NOBURO</creator><creator>KARIYA TOSHIMITSU</creator><scope>EVB</scope></search><sort><creationdate>20140417</creationdate><title>VAPOR DEPOSITION APPARATUS, AND VAPOR DEPOSITION METHOD</title><author>TAKAHASHI MASARU ; MATSUMOTO EIICHI ; TAMURA HIROYUKI ; FUJITSUKA MASANAO ; SHIOIRI NOBURO ; KARIYA TOSHIMITSU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2014065936A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKAHASHI MASARU</creatorcontrib><creatorcontrib>MATSUMOTO EIICHI</creatorcontrib><creatorcontrib>TAMURA HIROYUKI</creatorcontrib><creatorcontrib>FUJITSUKA MASANAO</creatorcontrib><creatorcontrib>SHIOIRI NOBURO</creatorcontrib><creatorcontrib>KARIYA TOSHIMITSU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKAHASHI MASARU</au><au>MATSUMOTO EIICHI</au><au>TAMURA HIROYUKI</au><au>FUJITSUKA MASANAO</au><au>SHIOIRI NOBURO</au><au>KARIYA TOSHIMITSU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>VAPOR DEPOSITION APPARATUS, AND VAPOR DEPOSITION METHOD</title><date>2014-04-17</date><risdate>2014</risdate><abstract>PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus capable of highly-precise vapor deposition in which a mask frame of low-cost and light-weight is constituted while a substrate and a vapor deposition mask are moved separately relatively to each other, vapor deposition mask exchanging and so on are performed very easily and vapor deposition pattern deviation due to temperature rising is not caused because of suppression of temperature rising.SOLUTION: In a vapor deposition apparatus, a substrate 4 is moved relatively against a mask holder 6 having a dispersion-limiting section to limit a dispersion direction of evaporated particles and against an evaporation source 1, with keeping to be separate from a vapor deposition mask 2 mounted at the mask holder 6, to realize vapor deposition over a wider area than the vapor deposition mask 2. The mask holder 6 is constituted as separate bodies of a mask frame 6A equipped with the vapor deposition mask 2 and a mask frame holder 6B equipped with the dispersion-limiting section and a temperature control unit 9. A mask frame 6A mounted in contact at the mask frame holder 6B is constituted as detachable.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JP2014065936A |
| source | esp@cenet |
| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | VAPOR DEPOSITION APPARATUS, AND VAPOR DEPOSITION METHOD |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-24T22%3A24%3A47IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TAKAHASHI%20MASARU&rft.date=2014-04-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2014065936A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |