VAPOR DEPOSITION APPARATUS, AND VAPOR DEPOSITION METHOD

PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus capable of highly-precise vapor deposition in which a mask frame of low-cost and light-weight is constituted while a substrate and a vapor deposition mask are moved separately relatively to each other, vapor deposition mask exchanging and...

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Bibliographische Detailangaben
Hauptverfasser: TAKAHASHI MASARU, MATSUMOTO EIICHI, TAMURA HIROYUKI, FUJITSUKA MASANAO, SHIOIRI NOBURO, KARIYA TOSHIMITSU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus capable of highly-precise vapor deposition in which a mask frame of low-cost and light-weight is constituted while a substrate and a vapor deposition mask are moved separately relatively to each other, vapor deposition mask exchanging and so on are performed very easily and vapor deposition pattern deviation due to temperature rising is not caused because of suppression of temperature rising.SOLUTION: In a vapor deposition apparatus, a substrate 4 is moved relatively against a mask holder 6 having a dispersion-limiting section to limit a dispersion direction of evaporated particles and against an evaporation source 1, with keeping to be separate from a vapor deposition mask 2 mounted at the mask holder 6, to realize vapor deposition over a wider area than the vapor deposition mask 2. The mask holder 6 is constituted as separate bodies of a mask frame 6A equipped with the vapor deposition mask 2 and a mask frame holder 6B equipped with the dispersion-limiting section and a temperature control unit 9. A mask frame 6A mounted in contact at the mask frame holder 6B is constituted as detachable.