VAPOR DEPOSITION MASK MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a method for manufacturing a vapor deposition mask that can be made light even when it is made large, and by which an opening of a resin mask and a slit of a metal mask can be precisely formed.SOLUTION: A method for manufacturing a vapor deposition mask 100 formed by...

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Bibliographische Detailangaben
Hauptverfasser:	OBATA KATSUYA, TAKEDA TOSHIHIKO, KENMORI HIDESUKE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for manufacturing a vapor deposition mask that can be made light even when it is made large, and by which an opening of a resin mask and a slit of a metal mask can be precisely formed.SOLUTION: A method for manufacturing a vapor deposition mask 100 formed by laminating a metal mask 15 with a slit 16, and a resin mask 25 provided with an opening 50 corresponding to a vapor deposition manufactured pattern comprises the steps of: preparing a metallic plate 10 with a resin layer on one surface of which a resin layer 20 is provided; forming a resin mask 25 on the resin layer by forming an opening corresponding to the vapor deposition manufactured pattern; and forming the metal mask by applying etching from a face side not contacting the resin mask of the metallic plate and forming a slit penetrating through the metallic plate and overlaid on an opening of the resin mask.