ANISOTROPIC CONDUCTIVE ADHESIVE

PROBLEM TO BE SOLVED: To provide an anisotropic conductive adhesive which is capable of achieving high heat dissipation performance.SOLUTION: Conductive particles (31) and diamond particles (32) with an average grain diameter smaller than that of the conductive particles (31) are dispersed in a bind...

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Bibliographische Detailangaben
Hauptverfasser:	KANIZAWA MORIYUKI, ISHIGAMI AKIRA, NAMIKI HIDEJI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS CURRENT COLLECTORS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS LINE CONNECTORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an anisotropic conductive adhesive which is capable of achieving high heat dissipation performance.SOLUTION: Conductive particles (31) and diamond particles (32) with an average grain diameter smaller than that of the conductive particles (31) are dispersed in a binder. In an LED package which is obtained by thermal compression bonding using this anisotropic conductive adhesive, terminals (electrodes (12a, 14a)) of an LED element and terminals (electrodes (22a, 23a)) of a substrate are electrically connected with each other through the conductive particles (31), while the diamond particles (32) are caught between the terminals of the LED element and the terminals of the substrate.