LEAF SPRING FOR CAMERA MODULE DRIVE MECHANISM AND MANUFACTURING METHOD FOR THE SAME

PROBLEM TO BE SOLVED: To provide a leaf spring for a camera module drive mechanism, which enables use of solder with better wettability.SOLUTION: A method of manufacturing a leaf spring with electrical connection terminals for a camera module drive mechanism includes the steps of: preparing a leaf s...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: UENO YOSHIMASA, IKENAGA CHIKAO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a leaf spring for a camera module drive mechanism, which enables use of solder with better wettability.SOLUTION: A method of manufacturing a leaf spring with electrical connection terminals for a camera module drive mechanism includes the steps of: preparing a leaf spring material 40; etching and half-etching the leaf spring material 40 using resist 41; and removing the resist 41 from the leaf spring material 40. An external shape of the leaf spring material 40 is formed through the etching process and connection terminals 11d, 11e are formed through the half-etching process.