HEAT-CONDUCTIVE ADHESIVE SHEET AND ELECTRONIC/ELECTRIC APPARATUS

PROBLEM TO BE SOLVED: To provide a heat-conductive adhesive sheet capable of inhibiting, while realizing an excellent heat conductivity, the peeling thereof from an adhesion target in response to external vibrations or impacts and an electronic/electric apparatus equipped with the heat-conductive ad...

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Bibliographische Detailangaben
Hauptverfasser:	TOJO MIDORI, TSUCHIYA TAISUKE, TERADA YOSHIO, AOIKE SHUHEI, YAMAGUCHI SAYAKA, DEGAWA OSAMU
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a heat-conductive adhesive sheet capable of inhibiting, while realizing an excellent heat conductivity, the peeling thereof from an adhesion target in response to external vibrations or impacts and an electronic/electric apparatus equipped with the heat-conductive adhesive sheet.SOLUTION: An adhesive layer 2 including heat-conductive particles and having a punch-through adhesive strength of 5 N/cmor above in relation to a stainless steel sheet, an elongation of 200% or above as it is measured by a tensile test, and a heat conductivity of 0.30 W/m K or above is provided on a heat-conductive adhesive sheet pasted onto an adhesion target of an electronic/electric apparatus.