THERMOSETTING RESIN COMPOSITION, RESIN FILM IN B-STAGE, METAL FOIL, COPPER-CLAD PLATE, AND MULTILAYER BUILDUP SUBSTRATE

PROBLEM TO BE SOLVED: To provide an epoxy-based thermosetting resin which shows flexibility, can be formed into a thin insulating layer, has reliability and processing characteristics comparable to a halogen-free FR-4, and causes little resin flow during vacuum pressing.SOLUTION: The thermosetting r...

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Bibliographische Detailangaben
Hauptverfasser:	TANAHASHI YUSUKE, ISHIZAKA MASANOBU, KAKIUCHI NAOYA
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an epoxy-based thermosetting resin which shows flexibility, can be formed into a thin insulating layer, has reliability and processing characteristics comparable to a halogen-free FR-4, and causes little resin flow during vacuum pressing.SOLUTION: The thermosetting resin composition comprises (a1) a liquid epoxy resin, (a2) a solid epoxy resin, (b) an aromatic diamine compound having an ether group, (c) a solvent-soluble polyimide resin having a weight average molecular weight Mw of 50000 or less, and (d) a phenoxy resin. When the total amount of the (a1) liquid epoxy resin, the (a2) solid epoxy resin and the (b) diamine compound is set to 100 parts by weight, the total amount of the (c) solvent-soluble polyimide resin and the (d) phenoxy resin is 15 parts by weight or more and 100 parts by weight or less.