SEMICONDUCTOR DEVICE MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device.SOLUTION: In a semiconductor device of an embodiment 1, a mark MK1 corresponding to a bonding region of a belt-like wiring BLW exposed from an opening OP1 which is formed in a solder resist SR is provided. By doing this, a coordi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YASUNAGA MASATOSHI, KURODA SOJI, HIRONAGA KAZUYA, HIRAI TATSUYA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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