SEMICONDUCTOR DEVICE MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device.SOLUTION: In a semiconductor device of an embodiment 1, a mark MK1 corresponding to a bonding region of a belt-like wiring BLW exposed from an opening OP1 which is formed in a solder resist SR is provided. By doing this, a coordinate position of a wire bonding region can be adjusted in an alignment process of the wire bonding region without reference to an end of the opening OP1 formed in the solder resist SR but with reference to the mark MK1 correspondingly formed to the wire bonding region. Further, in the semiconductor device of the embodiment 1, since the mark MK1 which functions as a feature pattern is formed, adjustment of the wire bonding region by camera recognition can be performed.