NICKEL PLATING SOLUTION AND METHOD FOR FORMING NICKEL PLATING LAYER USING THE SAME

PROBLEM TO BE SOLVED: To provide a method for forming a nickel plating solution capable of minimizing damage to a coating of a chip surface without an additional process.SOLUTION: Provided is an electric nickel plating solution, in which a nickel plating layer is formed on an external electrode 200...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	NAM HYO SEUNG, KIM MI GEUM
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INDUCTANCES MAGNETS METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS RESISTORS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES TRANSFORMERS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for forming a nickel plating solution capable of minimizing damage to a coating of a chip surface without an additional process.SOLUTION: Provided is an electric nickel plating solution, in which a nickel plating layer is formed on an external electrode 200 of a chip component having a body formed of a material 100 including ferrite or manganese oxide, the nickel plating solution including a nickel ion, a chloride ion, and a pH buffer, where the pH buffer is used by mixing an inorganic acid and an organic acid. The electric nickel plating solution is used to reduce damage to the body.