METHOD AND SYSTEM FOR DISSIPATING HEAT IN OPTICAL COMMUNICATION MODULE

PROBLEM TO BE SOLVED: To provide a method and a system for dissipating heat in an optical communication system, that have improved heat dissipation effects and that are efficient in terms of space utilization.SOLUTION: Heat dissipation resources are allocated in an optical communications module base...

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Bibliographische Detailangaben
Hauptverfasser:	CHAN SENG-KUM, DAVID J K MEADOWCROFT
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DEVICES USING STIMULATED EMISSION ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TRANSMISSION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method and a system for dissipating heat in an optical communication system, that have improved heat dissipation effects and that are efficient in terms of space utilization.SOLUTION: Heat dissipation resources are allocated in an optical communications module based on the sensitivity of electrical and optoelectronic components of the module to temperature. Components that have a higher sensitivity to temperature are allocated a greater proportion of available heat dissipation resources than components that have a lower sensitivity to temperature. In addition, heat dissipation resources that are allocated to components that have different sensitivities to temperature are thermally decoupled from one another.