PEELING SYSTEM

PROBLEM TO BE SOLVED: To enhance the throughput.SOLUTION: A peeling system includes a first processing block, and a second processing block. The first processing block includes a first transport device, a peeling station, a first cleaning station, a pasting station, and a carry-out station. In the p...

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Bibliographische Detailangaben
1. Verfasser:	HIRAKAWA OSAMU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To enhance the throughput.SOLUTION: A peeling system includes a first processing block, and a second processing block. The first processing block includes a first transport device, a peeling station, a first cleaning station, a pasting station, and a carry-out station. In the peeling station, a peeling device for peeling a superposed substrate, transported by a first transport device, into a first substrate and a second substrate by sliding the superposed substrate, while heating, along the joint surface of the first substrate and second substrate is installed. The second processing block includes a second cleaning station, a first delivery station, a carry-in/carry-out station, a second transport device, and a second delivery station.