ELECTRONIC APPARATUS AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To solve a problem of peeling occurring between a die pad and a semiconductor chip caused by cracks which occur in a connection material lying between the die pad and the semiconductor chip resulting from a temperature cycle.SOLUTION: A plane area of a connection material connecting a mounting substrate with a die pad is smaller than that of a lower surface of the die pad exposed from a semiconductor package material. An electronic apparatus includes a semiconductor device and the mounting substrate. The semiconductor device includes: the die pad; a semiconductor chip on the die pad; the connection material which connects the die pad with the semiconductor chip; and the semiconductor package material which covers an upper part of the semiconductor chip and a side surface of the die pad.