NORMAL TEMPERATURE JUNCTION DEVICE AND NORMAL TEMPERATURE JUNCTION METHOD

PROBLEM TO BE SOLVED: To suppress to adhere impurities to a substrate or an intermediate layer when carrying out normal temperature junction of the substrate.SOLUTION: The normal temperature junction device comprises: a vacuum vessel 1; a first holding mechanism 3a which holds a first substrate 4; a second holding mechanism 3b which holds a second substrate 4; a beam source 6 which emits active beam to irradiate a bonded surface of the first substrate 4 and the second substrate 4; and a pressure welding mechanism 5 which piles up and joins the bonded surface of both the substrates 4 on which target materials adhere. At least one of the vacuum vessel 1, the first and second holding mechanism 3a and 3b, the beam source 6, and the pressure welding mechanism 5 is formed or covered with a first material which is hard to sputtering due to the active beam 6 or does not harm the function of the device which joins both the substrates 4, even on the bonded surface.