COMPONENT MOUNTING METHOD, COMPONENT MOUNTING DEVICE, AND PROGRAM

PROBLEM TO BE SOLVED: To allow for correction of a component mounting position, by measuring the print deviation amount of solder paste in a component mounting process by the configuration of an existing component mounting device.SOLUTION: A component mounting device captures the image of a predeter...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FUSHIMI SATOSHI, KAWAI AKISUKE
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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