COMPONENT MOUNTING METHOD, COMPONENT MOUNTING DEVICE, AND PROGRAM

PROBLEM TO BE SOLVED: To allow for correction of a component mounting position, by measuring the print deviation amount of solder paste in a component mounting process by the configuration of an existing component mounting device.SOLUTION: A component mounting device captures the image of a predetermined area on a substrate where a component is mounted by using means for recognizing the substrate, specifies a position in the predetermined area where the component is mounted and a position where a solder paste is printed, calculates the difference between the mounting position thus specified and the position where a solder paste is printed, corrects the mounting position by using the difference of position thus specified, and then mounts the component at a position corrected, thus enhancing the accuracy of mounting position of a component.