COMPONENT MOUNTING METHOD, COMPONENT MOUNTING DEVICE, AND PROGRAM

COMPONENT MOUNTING METHOD, COMPONENT MOUNTING DEVICE, AND PROGRAM

PROBLEM TO BE SOLVED: To allow for correction of a component mounting position, by measuring the print deviation amount of solder paste in a component mounting process by the configuration of an existing component mounting device.SOLUTION: A component mounting device captures the image of a predeter...

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Hauptverfasser: FUSHIMI SATOSHI, KAWAI AKISUKE
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator FUSHIMI SATOSHI
KAWAI AKISUKE
description PROBLEM TO BE SOLVED: To allow for correction of a component mounting position, by measuring the print deviation amount of solder paste in a component mounting process by the configuration of an existing component mounting device.SOLUTION: A component mounting device captures the image of a predetermined area on a substrate where a component is mounted by using means for recognizing the substrate, specifies a position in the predetermined area where the component is mounted and a position where a solder paste is printed, calculates the difference between the mounting position thus specified and the position where a solder paste is printed, corrects the mounting position by using the difference of position thus specified, and then mounts the component at a position corrected, thus enhancing the accuracy of mounting position of a component.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title COMPONENT MOUNTING METHOD, COMPONENT MOUNTING DEVICE, AND PROGRAM
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