SEMICONDUCTOR DEVICE MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which forms junction of a source electrode layer and a drain electrode layer with an oxide semiconductor layer as ohmic junction.SOLUTION: A semiconductor device manufacturing method comprises: a process of performing a hea...

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Bibliographische Detailangaben
Hauptverfasser: KISHIDA HIDEYUKI, IMAFUJI TOSHIKAZU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which forms junction of a source electrode layer and a drain electrode layer with an oxide semiconductor layer as ohmic junction.SOLUTION: A semiconductor device manufacturing method comprises: a process of performing a heat treatment on an oxide semiconductor film; and forming between an oxide semiconductor film and a source electrode layer, after the process of heat treatment, a first region having an oxygen concentration lower than that of the oxide semiconductor film, and forming between the oxide semiconductor film and a drain electrode layer, a second region having an oxygen concentration lower than that of the oxide semiconductor film. Since each of the first region and the second region has a lower oxygen concentration than that of the oxide semiconductor film, resistance is low and ohmic junction can be formed.