SUBSTRATE FOR HIGH-FREQUENCY CIRCUIT

PROBLEM TO BE SOLVED: To provide a substrate for a high-frequency circuit, which is capable of reducing transmission loss of en electric signal in a high-frequency circuit and in which adhesion between a metal foil and a resin layer is high and the resin layer has a low dielectric constant, a low di...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MOGI SHIGERU, TSUJI MAKOTO, AKATSUKA YASUMASA, SEKINE KENJI, UCHIDA MAKOTO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a substrate for a high-frequency circuit, which is capable of reducing transmission loss of en electric signal in a high-frequency circuit and in which adhesion between a metal foil and a resin layer is high and the resin layer has a low dielectric constant, a low dielectric loss tangent, and low hygroscopicity.SOLUTION: The substrate for a high-frequency circuit of the present invention is formed of a laminate comprising a resin layer and a metal foil laminated on at least one main surface of the resin layer via a primer resin layer. The resin layer is a heat-cured product of a varnish containing a polyamic acid, a fluororesin, and an organic solvent. A base resin of the primer resin layer is a soluble polyimide resin represented by formula (1). In the formula, Rrepresents a specific tetravalent aromatic group, Rrepresents a specific divalent aromatic group, and n1 as the number of repetitions represents an integer of 10-1000.