ELECTRONIC COMPONENT BUILT-IN SUBSTRATE

PROBLEM TO BE SOLVED: To provide an electronic component built-in substrate capable of minimizing deformation, such as warpage and distortion, which occurs in the electronic component built-in substrate due to a rigidity difference between a low rigidity region and a high rigidity region that are ge...

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Bibliographische Detailangaben
Hauptverfasser:	HAMADA YOSHIKI, KAGAWA TOSHIYUKI, SARUWATARI TATSURO, SUGIYAMA YUICHI, INOUE YUSUKE, MIYAZAKI MASASHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electronic component built-in substrate capable of minimizing deformation, such as warpage and distortion, which occurs in the electronic component built-in substrate due to a rigidity difference between a low rigidity region and a high rigidity region that are generated in a core layer.SOLUTION: In an electronic component built-in substrate, electronic components 12 are respectively housed in multiple housing parts 11a1 formed at a core layer 11a, and multiple cavity parts 11a2 filled with an insulation material 11k are provided at the core layer 11a.