HEAT SHRINKAGE MULTILAYER FILM AND PACKAGING BAG USING THE SAME

PROBLEM TO BE SOLVED: To provide a heat shrinkage multilayer film that is capable of shrink packaging and has an excellent cuttability even after heating by microwave oven or the like.SOLUTION: Such a heat shrinkage multilayer film is a heat shrinkage multilayer film comprising a substrate layer and...

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Bibliographische Detailangaben
Hauptverfasser: YOSHINO MASAYUKI, MATSUKI YUTAKA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a heat shrinkage multilayer film that is capable of shrink packaging and has an excellent cuttability even after heating by microwave oven or the like.SOLUTION: Such a heat shrinkage multilayer film is a heat shrinkage multilayer film comprising a substrate layer and a heat seal layer laminated on the substrate layer, wherein the substrate layer is a layer formed by crosslinking treatment to a first resin composition comprising 25 to 70 mass% of medium-high-density polyethylene and 5 to 25 mass% of high pressure method low density polyethylene and 25 to 60 mass% of polypropylene resin; and the heat seal layer is a layer formed by crosslinking treatment to a second resin composition comprising one or more ethylenic polymers, and the shrinkage percentage at 100°C measured in accordance with the measuring method of ASTM D2732 is 10% or less and also the heat shrinkage percentage at 140°C is 60% or more, and the gel fraction is 20 mass% or more.