SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device excellent in assemblability of a bus bar for lead-out with a terminal of a first semiconductor module and a terminal of a second semiconductor module which are arranged on a liquid-cooled cooler.SOLUTION: A semiconductor device comprises: semic...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KAMIYA KAZUNOBU, HIGASHIMOTO SHIGEKAZU, TAKEUCHI KAZUYOSHI, MASUTANI MUNEHIKO
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a semiconductor device excellent in assemblability of a bus bar for lead-out with a terminal of a first semiconductor module and a terminal of a second semiconductor module which are arranged on a liquid-cooled cooler.SOLUTION: A semiconductor device comprises: semiconductor modules 30, 31, 32, 40, 41, 42 arranged on a top surface and an undersurface of a liquid-cooled cooler 20; a bus bar 50 including a confluence part 53 which converges at a point equidistant from a pair of fastening parts 51, 52 connected to a terminal 70 of a first semiconductor module and terminal 71 of a second semiconductor module extends in a direction apart from the liquid-cooled cooler 20; and a stopper 60 arranged at the fastening parts 51, 52 of the bus bar into which bolts 80, 81 are threaded to fasten the fastening parts 51, 52 and the terminals 70, 71.