PACKAGE CARRIER AND MANUFACTURING METHOD THEREFOR

PROBLEM TO BE SOLVED: To provide a package carrier which increases the use reliability, by reducing thermal expansion difference effectively when the package carrier is mounting a heating element, and to provide a manufacturing method therefor.SOLUTION: An insulating substrate having an upper surface, a lower surface, a plurality of cavities installed on the lower surface, and a plurality of through holes communicating, respectively, with the cavities by passing through the insulating substrate is provided. A plurality of vias are defined by the cavities and through holes. A plurality of conductive posts are defined by forming a conductive material filling the vias. An insulating layer having a top face and a plurality of blind vias extending from the top face to the conductive post is formed on the upper surface. A patterning circuit layer filling the blind vias, connected with the conductive post, and exposing a part of the top face is formed on the top face. A solder mask layer having a plurality of openings for defining a plurality of pads by exposing a part of the patterning circuit layer is formed on the patterning circuit layer.