SYSTEMS AND METHODS FOR DISSIPATING HEAT IN ENCLOSURE

PROBLEM TO BE SOLVED: To provide an enclosure including a synthetic assembly configured to dissipate heat from one or more walls.SOLUTION: An enclosure 102 includes an outer casing 106 having one or more walls. Further, the enclosure includes a synthetic jet assembly 134 configured to dissipate heat...

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Bibliographische Detailangaben
Hauptverfasser:	BRIAN PATRICK WEHLEN, WILLIAM EARL GROSS JR, MEIER ROBERT PAUL, DE BOCK HENDRIK PIETER JACOBUS
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING VEHICLES IN GENERAL VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISEPROVIDED FOR
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an enclosure including a synthetic assembly configured to dissipate heat from one or more walls.SOLUTION: An enclosure 102 includes an outer casing 106 having one or more walls. Further, the enclosure includes a synthetic jet assembly 134 configured to dissipate heat from the one or more walls 122, 124, 126, 128, 130. The synthetic jet assembly includes a bracket operatively coupled to the one or more walls of the outer casing, and two or more synthetic jets operatively coupled to the bracket. The two or more synthetic jets are arranged in a multi-dimensional array.