DEVICE MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a device manufacturing method capable of suppressing deterioration in surface morphology of a conductive part formed protruding from a fine recess provided in a part of a principal surface of a substrate when the conductive part is formed.SOLUTION: A device manufacturing method comprises at least: a first step of forming a barrier film 103 in a recess 102 provided on one surface 101a of a substrate and in a part thereof; a second step of forming a first conductive film 104 on the barrier film 103; a third step of melting the first conductive film 104; a fourth step of forming a second conductive film 105 on the first conductive film 104 by heating the barrier film 103, first conductive film 104, and substrate 101 passed through the third step; a fifth step of forming a third conductive film 107 on the second conductive film 105 passed through the fourth step; and a sixth step of removing a part composed of the barrier film 103, the first conductive film 104, and the second conductive film 105, and the third conductive film 107 passed through the fifth step and formed outside the one surface 101a of the substrate.