SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device which enables the size reduction and the weight reduction of a cooler.SOLUTION: A semiconductor device 10 includes: a semiconductor module 12; and a cooler 11. The cooler 11 includes a plate 21a in which the semiconductor module 12 is thermally...

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1. Verfasser:	KONO EIJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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creator	KONO EIJI
description	PROBLEM TO BE SOLVED: To provide a semiconductor device which enables the size reduction and the weight reduction of a cooler.SOLUTION: A semiconductor device 10 includes: a semiconductor module 12; and a cooler 11. The cooler 11 includes a plate 21a in which the semiconductor module 12 is thermally connected with an outer surface and a fin unit 31 which is thermally connected with the semiconductor module 12 through the plate 21a. The semiconductor module 12 is fixed to the cooler 11 by threadedly engaging a screw 13, which penetrates the plate 21a and protrudes into the cooler 11, with a female screw 34a formed on an inner peripheral surface of an attachment pin fin 34.
format	Patent
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subjects	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
title	SEMICONDUCTOR DEVICE
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