SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device which enables the size reduction and the weight reduction of a cooler.SOLUTION: A semiconductor device 10 includes: a semiconductor module 12; and a cooler 11. The cooler 11 includes a plate 21a in which the semiconductor module 12 is thermally...

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1. Verfasser: KONO EIJI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a semiconductor device which enables the size reduction and the weight reduction of a cooler.SOLUTION: A semiconductor device 10 includes: a semiconductor module 12; and a cooler 11. The cooler 11 includes a plate 21a in which the semiconductor module 12 is thermally connected with an outer surface and a fin unit 31 which is thermally connected with the semiconductor module 12 through the plate 21a. The semiconductor module 12 is fixed to the cooler 11 by threadedly engaging a screw 13, which penetrates the plate 21a and protrudes into the cooler 11, with a female screw 34a formed on an inner peripheral surface of an attachment pin fin 34.