SEMICONDUCTOR DEVICE AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

PROBLEM TO BE SOLVED: To provide a technique, which allows manufacturers who package SiP (System in Package) products to repair defects of a memory chip that have occurred in its packaging process or after the process without using a defect repair technique of the memory chip, for the SiP products that have the memory chip and a logic chip packaged in an identical package.SOLUTION: The logic chip includes: a comparison circuit that compares an address of a defective memory cell of the memory chip, which is detected beforehand, with an address that is generated for the logic chip to access the memory chip; a storage circuit; and a selection circuit. If the address for the access matches the address of the defective memory cell, the selection circuit makes a change so as to cause the storage circuit provided in the logic chip to be accessed instead of the access target memory chip.