VAPOR DEPOSITION DEVICE AND VAPOR DEPOSITION METHOD
PROBLEM TO BE SOLVED: To provide a vapor deposition device capable of simply realizing a constitution for alternately vapor depositing two substrates in the same vapor deposition chamber at low costs.SOLUTION: A vapor deposition device comprises: a vapor deposition chamber 4 inside of which is secti...
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creator | MISAWA KEITA WATANABE KAZUHIRO MATSUMOTO EIICHI |
description | PROBLEM TO BE SOLVED: To provide a vapor deposition device capable of simply realizing a constitution for alternately vapor depositing two substrates in the same vapor deposition chamber at low costs.SOLUTION: A vapor deposition device comprises: a vapor deposition chamber 4 inside of which is sectioned into a first vapor deposition region 2 and a second vapor deposition region 3; and a linear vapor deposition source 5 relatively moving to substrates 1 and 1 conveyed in the first vapor deposition region 2 and the second vapor deposition region 3 to adhere vapor deposition material particles to vapor deposition surfaces of the respective substrates 1 and 1. The linear vapor deposition source 5 is moved in a direction orthogonal to a longitudinal direction of the linear vapor deposition source 5, so that slide mechanisms 8 and 25 relatively moving to the substrates 1 and 1 are arranged between the first vapor deposition region 2 and the second vapor deposition region 3. The linear vapor deposition source 5 is movably supported to the slide mechanisms 8 and 25, so that the linear vapor deposition source 5 is selectively arranged in the first vapor deposition region 2 or the second vapor deposition region 3. |
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The linear vapor deposition source 5 is moved in a direction orthogonal to a longitudinal direction of the linear vapor deposition source 5, so that slide mechanisms 8 and 25 relatively moving to the substrates 1 and 1 are arranged between the first vapor deposition region 2 and the second vapor deposition region 3. 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The linear vapor deposition source 5 is moved in a direction orthogonal to a longitudinal direction of the linear vapor deposition source 5, so that slide mechanisms 8 and 25 relatively moving to the substrates 1 and 1 are arranged between the first vapor deposition region 2 and the second vapor deposition region 3. The linear vapor deposition source 5 is movably supported to the slide mechanisms 8 and 25, so that the linear vapor deposition source 5 is selectively arranged in the first vapor deposition region 2 or the second vapor deposition region 3.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
title | VAPOR DEPOSITION DEVICE AND VAPOR DEPOSITION METHOD |
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