VAPOR DEPOSITION DEVICE AND VAPOR DEPOSITION METHOD

PROBLEM TO BE SOLVED: To provide a vapor deposition device capable of simply realizing a constitution for alternately vapor depositing two substrates in the same vapor deposition chamber at low costs.SOLUTION: A vapor deposition device comprises: a vapor deposition chamber 4 inside of which is secti...

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Bibliographische Detailangaben
Hauptverfasser: MISAWA KEITA, WATANABE KAZUHIRO, MATSUMOTO EIICHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a vapor deposition device capable of simply realizing a constitution for alternately vapor depositing two substrates in the same vapor deposition chamber at low costs.SOLUTION: A vapor deposition device comprises: a vapor deposition chamber 4 inside of which is sectioned into a first vapor deposition region 2 and a second vapor deposition region 3; and a linear vapor deposition source 5 relatively moving to substrates 1 and 1 conveyed in the first vapor deposition region 2 and the second vapor deposition region 3 to adhere vapor deposition material particles to vapor deposition surfaces of the respective substrates 1 and 1. The linear vapor deposition source 5 is moved in a direction orthogonal to a longitudinal direction of the linear vapor deposition source 5, so that slide mechanisms 8 and 25 relatively moving to the substrates 1 and 1 are arranged between the first vapor deposition region 2 and the second vapor deposition region 3. The linear vapor deposition source 5 is movably supported to the slide mechanisms 8 and 25, so that the linear vapor deposition source 5 is selectively arranged in the first vapor deposition region 2 or the second vapor deposition region 3.