CONTROLLER HOUSING
PROBLEM TO BE SOLVED: To place wire bonding for contact so that the wire bonding is installed on an end surface of a contact pin.SOLUTION: In a controller housing (12), a first housing portion (24) is formed as a container (28) and a bottom of the container (28) is formed as a heat radiation surface...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To place wire bonding for contact so that the wire bonding is installed on an end surface of a contact pin.SOLUTION: In a controller housing (12), a first housing portion (24) is formed as a container (28) and a bottom of the container (28) is formed as a heat radiation surface (14) for contact with another housing (10). The first housing portion (24) includes an edge part (34) annularly extending, and a rod like contact element (36) is housed in a fusion part (38) at the edge part (34). The rod like contact element (36) is fused to the edge part (34) in a vertical manner. |
---|