CONTROLLER HOUSING

PROBLEM TO BE SOLVED: To place wire bonding for contact so that the wire bonding is installed on an end surface of a contact pin.SOLUTION: In a controller housing (12), a first housing portion (24) is formed as a container (28) and a bottom of the container (28) is formed as a heat radiation surface...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ECKHARD SCHAEFER, WETZEL GERHARD, SIEMS HANS-DIETER, ULRICH TRESCHER, DERINGER HELMUT
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To place wire bonding for contact so that the wire bonding is installed on an end surface of a contact pin.SOLUTION: In a controller housing (12), a first housing portion (24) is formed as a container (28) and a bottom of the container (28) is formed as a heat radiation surface (14) for contact with another housing (10). The first housing portion (24) includes an edge part (34) annularly extending, and a rod like contact element (36) is housed in a fusion part (38) at the edge part (34). The rod like contact element (36) is fused to the edge part (34) in a vertical manner.